Topcover instrument cases 60 x 30 mm

image of an instrument electronic case

Rounded design with flat surfaces compact instrument enclosures with W × H = 60 × 30 mm for indoor use. The cases are molded from ASA or ABS plastic. Top and bottom snap-in together without screws. Ideal housing for sensors small communication units.
All the dimensions are in mm.

Nearest neighbors:

40
60×40
4 series
70×40
5 series
30
20
50 60 70
Part number Image Length Width Height Material PCB max IP max Comment
1 SIC3-5-2 Rounded design small enclosure for embedded devices 54 25 18 ASA or ABS UL94 HB 42,5 x 20 Screwless snap-in assembly, pillars for PCBs in the bottom part
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The data are taken from catalogs and webpages of the manufacturers. Please check dimensions and other parameters before starting the project.  Please let us know  if you notice an error.
electronic snap-in case for indoor use.
SIC serie of plastic enclosures for compact embedded solutions.